Inventor on a worldwide portfolio spanning four decades of defense and commercial hardware — 3D metal micromachining, hermetic optoelectronic packaging, mm-wave waveguide structures, and advanced materials.
The portfolio is concentrated in a handful of process and architecture areas that have followed the career arc.
The PolyStrata family — multilayer build processes, coaxial waveguide microstructures, hollow-core coaxial cables, and substrate-free interconnected mechanical structures. Originated at Nuvotronics; foundational to mm-wave RF.
High-frequency power combiners and dividers, broadband antenna arrays, waveguide baluns, transmission-line architectures, and integrated RF interconnects.
Wafer-level packaging for high-speed optoelectronics, hermetic laser packages, device-package fabrication and test methods, and solder-flow control structures.
Fiber arrays with wick-stop trenches, MEMS-based optical components, and silicon micromachining structures from the Haleos and ACT MicroDevices era.
Formulations for packaging electronic devices, dielectric structures, and process chemistries supporting hermetic and 3D-fabricated assemblies.
Filings span Haleos, Shipley / Rohm and Haas Electronic Materials, Nuvotronics, Cubic Corporation, BAE Systems, and Samsung Electronics — reflecting the program-by-program collaborations across the career.
The complete record is publicly searchable. The links below pre-filter the major patent databases by inventor name.
Note: third-party indexes can return results for similarly named inventors. The portfolio summarized here covers David W. Sherrer II at Haleos, Shipley / Rohm and Haas, Nuvotronics, and Cubic.