Career arc

David founded Haleos in 2000 to commercialize MEMS-based fiber optic components and optoelectronic packaging. The company was acquired by Rohm and Haas Electronic Materials in 2002. He then led product development at Rohm and Haas — managing hermetic laser packages, a 6-inch wafer fab, and the mm-wave packaging platform that would eventually become Nuvotronics.

In 2008 he founded Nuvotronics around the PolyStrata 3D metal micromachining process — work originating from DARPA's 3D-MERFS and DMT programs. Over the next decade Nuvotronics grew into a multimillion-dollar mm-wave technology company with deep partnerships across the largest U.S. commercial and defense primes. Cubic Corporation acquired Nuvotronics in 2019.

Today David leads MacroVation LLC as President and CEO, with Helicon Defense LLC as a co-founded RF and antenna venture (with Anatoliy Boryssenko, also a Nuvotronics alumnus). Both operate under the NuvoNexus, LLC parent.

Selected timeline

2023 — Present
President & CEO — MacroVation LLC
Fairlawn, VA
Defense R&D operating company. Advanced materials, composite tooling, and counter-threat hardware. Active SBIR programs for U.S. defense customers.
2024 — Present
Co-founder & CEO — Helicon Defense LLC
With Anatoliy Boryssenko
RF and antenna systems venture for defense applications. Applied research to fielded hardware.
2019 — Present
Founder & CEO — NuvoNexus, LLC
Cocoa Beach, FL
Parent holding company for the operating ventures and a platform for emerging deep-tech investments.
2008 — 2019
Founder & President — Nuvotronics
Blacksburg, VA · Durham, NC
Built a mm-wave technology company on the PolyStrata 3D metal micromachining process. Originated from DARPA 3D-MERFS and DMT programs. Acquired by Cubic Corporation.
2002 — 2008
Director, R&D — Rohm and Haas Electronic Materials
$8B U.S. specialty materials company
Hermetic laser packaging, 6-inch wafer fab oversight, and the Polystrata mm-wave packaging platform that ultimately spun out as Nuvotronics. Member of corporate IP strategy team.
2000 — 2002
Founder & CEO — Haleos
First exit
MEMS-based fiber optic components and optoelectronics packaging. Acquired by Rohm and Haas Electronic Materials.
By the numbers

Track record

125+
Patents (inventor, worldwide)
2
Company exits
30+
Years operating
I–III
DARPA program phases
Operating philosophy

Build the thing nobody has built. Prove it works. Ship it.

The work that has held David's attention across four decades is the same in every chapter: take a physics-grade idea that should be possible on paper, find the materials and process science that make it real, and stand up the manufacturing that turns it into hardware a customer can actually buy.

The throughline across Haleos, Nuvotronics, and MacroVation is a preference for hard problems where chemistry and process engineering — not just system integration — decide whether the product exists at all.